Methods and apparatuses for thermal dissipation

Details Methods and apparatuses for thermal dissipation Methods and apparatuses for thermal dissipation

2008-06-17

2008-06-17

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S715000, C361S722000, C174S016300, C174S252000, C165S080300, C165S104330, C165S185000

Reexamination Certificate

active

07388753

ABSTRACT:
A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot allowing thermal dissipation from the card due to air flow over the heat sink. For one embodiment of the invention, heat producing components of the PC card are identified and a thermally conductive path is provided from the components to the extension portion of the PC card.

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International Search Report, , PCT/CA2006/000562, dated Aug. 1, 2006.

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