Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,...
Reexamination Certificate
2006-02-06
2009-10-13
Hug, Eric (Department: 1791)
Plastic and nonmetallic article shaping or treating: processes
With severing, removing material from preform mechanically,...
C264S319000
Reexamination Certificate
active
07601283
ABSTRACT:
Methods and apparatuses for shaping a corner of a printed circuit board are disclosed. An apparatus in accordance with one embodiment includes a carrier configured to releasably contact a printed circuit board, a curved contact surface positioned to roll against a corner of the printed circuit board. Optionally, another curved contact surface can be positioned to roll against another corner of the printed circuit board. The contact surface can be rotatable relative to the carrier about a rotation axis that is generally parallel to at least a portion of the curved contact surface. The contact surface can be continuous or discontinuous, and can shape the corner of the printed circuit board with a reduced tendency for damage to the printed circuit board. Multiple contact surfaces can be rotatable about different rotation axes.
REFERENCES:
patent: 2945259 (1960-07-01), Decker et al.
patent: 3213510 (1965-10-01), Mizer et al.
patent: 3344900 (1967-10-01), Drop
patent: 3603646 (1971-09-01), Leoff
patent: 3802559 (1974-04-01), Luchetti
patent: 3909341 (1975-09-01), Moscovita
patent: 4398457 (1983-08-01), Takahashi et al.
patent: 4495132 (1985-01-01), Johnson
patent: 4687267 (1987-08-01), Header et al.
patent: 4702163 (1987-10-01), Araki et al.
patent: 4981074 (1991-01-01), Machita et al.
patent: 5117963 (1992-06-01), Thayer et al.
patent: 5134932 (1992-08-01), Fujino
patent: 5226361 (1993-07-01), Grant et al.
patent: 6331105 (2001-12-01), Lee
patent: 6368540 (2002-04-01), Morales
patent: 2002/0174944 (2002-11-01), DeFrank et al.
patent: 2004/0222563 (2004-11-01), Walters et al.
patent: 62082032 (1987-04-01), None
Radoll's Gold Finger Beveling Products, Radoll Designs, Inc., 2 pages, retrieved from the Internet on Jul. 7, 1999, <URL: http://www.radoll.com/products/bevel.htm>.
Morales, Jr. Refugio C.
Walters, Jr. Paul R.
Huda Saeed M
Hug Eric
Micro)n Technology, Inc.
Perkins Coie LLP
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