Methods and apparatuses for removing material from discrete area

Details Methods and apparatuses for removing material from discrete area Methods and apparatuses for removing material from discrete area

1998-02-27

2000-11-28

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

438748, H01L 21302, H01L 21461

Patent

active

06153532&

ABSTRACT:
Methods and apparatuses for removing material from discrete areas on a semiconductor wafer are described. In one implementation, an etchant applicator is provided having a tip portion. Liquid etchant material is suspended proximate the tip portion and the etchant applicator is moved, together with the suspended liquid, sufficiently close to a discrete area on a wafer to transfer liquid etchant onto the discrete area. In various embodiments the tip portion can comprise fluid permeable materials, fluid-absorbent materials, and/or wick assemblies. An exhaust outlet can be provided operably proximate the tip portion for removing material from over the wafer. The tip portion can be moved to touch the discrete area.

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patent: 5001084 (1991-03-01), Kawai et al.
patent: 5185056 (1993-02-01), Fuentes et al.
patent: 5271798 (1993-12-01), Sandhu et al.
patent: 5743959 (1998-04-01), Ash et al.

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