Methods and apparatuses for providing a hermetic sealing...

Details Methods and apparatuses for providing a hermetic sealing... Methods and apparatuses for providing a hermetic sealing...

2007-08-29

2010-11-30

Healy, Brian M (Department: 2883)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S092000, C385S014000, C385S052000, C398S135000, C438S026000, C438S027000, C029S842000, C029S843000

Reexamination Certificate

active

07841781

ABSTRACT:
In an optical transceiver module, the bottom surface of the lid is temporarily attached to the top surface of the submount assembly in a pre-alignment position prior to performing the solder flowing process in order to prevent the lid from shifting position during the solder flowing process. The solder flowing process is then performed to melt the solder. When the solder melts, the surface tension of the melted solder pulls the lid into its ultimate, or permanent, aligned position. The solder is then cooled, causing it to harden, thereby securing the lid to the submount assembly in its ultimate, permanently aligned position. The hardened solder between the top surface of the submount assembly and the bottom surface of the lid forms a hermetic seal that encloses components on the transmit side of the transceiver module in a hermetically-sealed environment.

REFERENCES:
patent: 6331678 (2001-12-01), Wang et al.
patent: 7359642 (2008-04-01), Richardson et al.
patent: 7654752 (2010-02-01), Rosenberg
patent: 2002/0114592 (2002-08-01), Case et al.
patent: 2004/0021217 (2004-02-01), Epitaux et al.
patent: 2005/0058411 (2005-03-01), Finot et al.
patent: 2005/0105907 (2005-05-01), Richardson et al.
patent: 2008/0013959 (2008-01-01), Ishigami
patent: 2009/0060518 (2009-03-01), Wang

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