Methods and apparatuses for mechanical and...

Details Methods and apparatuses for mechanical and... Methods and apparatuses for mechanical and...

2005-11-15

2005-11-15

Nguyen, George (Department: 3723)

Abrading

Abrading process

Combined abrading

C451S056000, C451S444000, C451S443000

Reexamination Certificate

active

06964602

ABSTRACT:
Apparatuses and methods for planarizing a microelectronic-device substrate assembly on a planarizing pad. In one aspect of the invention, material is removed from the substrate assembly by pressing the substrate assembly against a planarizing surface of a planarizing pad and moving the substrate assembly across the planarizing surface through a planarizing zone. The method also includes replacing at least a portion of a used volume of planarizing solution on the planarizing surface with fresh planarizing solution during the planarization cycle of a single substrate assembly. The used planarizing solution can be replaced with fresh planarizing solution by actively removing the used planarizing solution from the pad with a removing unit and depositing fresh planarizing solution onto the pad in the planarizing zone. The used planarizing solution, for example, can be removed either while the substrate assembly is moved through the planarizing zone, or between planarizing stages of a multi-stage planarizing process. In another aspect of the invention, a planarizing machine for planarizing microelectronic-device substrate assemblies includes removing unit at the accumulation zone to actively remove used planarizing solution from the accumulation zone on the stationary planarizing pad.

REFERENCES:
patent: 5584749 (1996-12-01), Mitsuhashi et al.
patent: 5645682 (1997-07-01), Skrovan
patent: 5658185 (1997-08-01), Morgan et al.
patent: 5707492 (1998-01-01), Stager et al.
patent: 5709593 (1998-01-01), Guthrie et al.
patent: 5775983 (1998-07-01), Shendon et al.
patent: 5782675 (1998-07-01), Southwick
patent: 5827781 (1998-10-01), Skrovan et al.
patent: 5836806 (1998-11-01), Cadien et al.
patent: 5846336 (1998-12-01), Skrovan
patent: 5885137 (1999-03-01), Ploessl
patent: 5885147 (1999-03-01), Kreager et al.
patent: 5902173 (1999-05-01), Tanaka
patent: 5913712 (1999-06-01), Molinar
patent: 5916010 (1999-06-01), Varian et al.
patent: 5941762 (1999-08-01), Ravkin et al.
patent: 5945346 (1999-08-01), Vanell et al.
patent: 5961377 (1999-10-01), Jeong
patent: 5968843 (1999-10-01), Dawson et al.
patent: 6004196 (1999-12-01), Doan et al.
patent: 6022266 (2000-02-01), Bullard et al.
patent: 6051495 (2000-04-01), Burke et al.
patent: 6106728 (2000-08-01), Iida et al.
patent: 6123607 (2000-09-01), Ravkin et al.
patent: 6135868 (2000-10-01), Brown et al.
patent: 6159076 (2000-12-01), Sun et al.
patent: 6190236 (2001-02-01), Drill
patent: 6217416 (2001-04-01), Kaufman et al.
patent: 6241587 (2001-06-01), Drill et al.
patent: 6250994 (2001-06-01), Chopra et al.
patent: 6340434 (2002-01-01), Mizuno et al.
patent: 6371838 (2002-04-01), Holzapfel
patent: 6379230 (2002-04-01), Hayashi et al.
patent: 6511365 (2003-01-01), Terashima et al.
patent: 6561878 (2003-05-01), Chopra et al.
patent: 6609957 (2003-08-01), Chopra et al.
patent: 6638148 (2003-10-01), Chopra et al.
patent: 6648736 (2003-11-01), Chopra et al.
patent: 6652364 (2003-11-01), Chopra et al.
patent: 6692338 (2004-02-01), Kirchner
patent: 6712676 (2004-03-01), Chopra et al.
patent: 6716090 (2004-04-01), Chopra et al.
patent: 6746316 (2004-06-01), Chopra et al.

Affiliated with

Also associated with

Rating

Methods and apparatuses for mechanical and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatuses for mechanical and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatuses for mechanical and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3515441