Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2008-03-04
2010-12-14
Nguyen, Ha Tran T (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
07852097
ABSTRACT:
An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
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Asmerom George
Jedda Max
Nayak Uday
Zhang Xiaolan
Nguyen Ha Tran T
Nguyen Tung X
Scheller, Jr. James C.
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