Methods and apparatuses for heating semiconductor wafers

Details Methods and apparatuses for heating semiconductor wafers Methods and apparatuses for heating semiconductor wafers

2011-08-30

2011-08-30

Wilson, Gregory A (Department: 3749)

Heating

Processes of heating or heater operation

Including preparing or arranging work for heating

C432S247000, C438S795000

Reexamination Certificate

active

08007275

ABSTRACT:
Methods and apparatuses for heat treatment of semiconductor wafers are disclosed herein. A method of heating a semiconductor wafer in accordance with one embodiment includes heating the wafer in a loading enclosure of a heat treatment system above an ambient temperature external to the loading enclosure. The method also includes moving the heated wafer from the loading enclosure into a processing enclosure of the heat treatment system. In particular embodiments, the method can further include heating a flow of purge gas above the ambient temperature and introducing the flow of heated purge gas into the loading enclosure while the wafer is in the loading enclosure. In still further embodiments, the method can include heating a flow of process gas to a processing temperature and introducing the heated flow of process gas into the processing enclosure while the wafer is in the processing enclosure.

REFERENCES:
patent: 5000682 (1991-03-01), Heidt et al.
patent: 5001327 (1991-03-01), Hirasawa et al.
patent: 5058526 (1991-10-01), Matsushita et al.
patent: 5273423 (1993-12-01), Shiraiwa
patent: 5277579 (1994-01-01), Takanabe
patent: 5378283 (1995-01-01), Ushikawa
patent: 5387265 (1995-02-01), Kazikazi et al.
patent: 5388944 (1995-02-01), Takanabe et al.
patent: 5447294 (1995-09-01), Sakata et al.
patent: 6174366 (2001-01-01), Ihantola
patent: 6726468 (2004-04-01), Ibrahim et al.
patent: 6729823 (2004-05-01), Sakata et al.
patent: 6852601 (2005-02-01), Yoshida et al.
patent: 6929774 (2005-08-01), Morad et al.
patent: 7033168 (2006-04-01), Gupta et al.
patent: 7056806 (2006-06-01), Basceri et al.
patent: 7179334 (2007-02-01), Sakamoto et al.
patent: 2001/0017294 (2001-08-01), Aoki et al.
patent: 2002/0084261 (2002-07-01), Yamazaki
patent: 2002/0096507 (2002-07-01), Nishitani et al.
patent: 2002/0182888 (2002-12-01), Buchanan et al.
patent: 2003/0106495 (2003-06-01), Asano et al.
patent: 2004/0022528 (2004-02-01), Yoo et al.
patent: 2004/0023517 (2004-02-01), Yoo
patent: 2004/0168638 (2004-09-01), Ishii et al.
patent: 2004/0175878 (2004-09-01), Takagi
patent: 2005/0016452 (2005-01-01), Ryu et al.
patent: 2005/0121145 (2005-06-01), Du Bois et al.
patent: 2006/0057800 (2006-03-01), Doan et al.
patent: 2006/0175304 (2006-08-01), Hwang et al.
patent: 2007/0128878 (2007-06-01), Izumi et al.
patent: 2007/0141812 (2007-06-01), Zagwijn et al.
patent: 2007/0151509 (2007-07-01), Park et al.
patent: 2007/0170088 (2007-07-01), Shimura
patent: 2001-153564 (2001-06-01), None
patent: 2006-46717 (2006-02-01), None
Fan, Yong-Hui and Taiqing Qiu, “Analyses of Thermal Stress and Control Schemes for Fast Temperature Ramps of Batch Furnaces,” IEEE Transactions on Semiconductor Manufacturing, vol. 10, No. 4, pp. 433-437, Nov. 1997.
Hasper, A. et al., “Advanced Manufacturing Equipment: A Vertical Batch Furnace for 300-mm Wafer Processing,” IEEE Micro, vol. 19, Issue 5, pp. 34-43, Sep./Oct. 1999.
Koyo Thermo Systems Co. Ltd., Vertical Furnace Furnaces for 300mm Semiconductor Wafer Processing, retrieved from the Internet on Jul. 12, 2007, <http://crystec.com.kllvf5700e.htm>.
Yoo, W.S. et al., “Ultra-Shallow Implant Anneal Using Single Wafer Rapid Thermal Furnace,” IEEE, Proceedings of the 14th International Conference on Ion Implantation Technology, pp. 87-90, Sep. 2002.

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