Methods and apparatuses for detaching components adhesively...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S583200, C156S098000, C029S402030, C029S426400

Reexamination Certificate

active

06716297

ABSTRACT:

FIELD OF THE INVENTION
The invention relates to methods for detaching components adhesively bonded to one another and apparatuses for detaching components adhesively bonded to one another.
BACKGROUND OF THE INVENTION
In industry and especially in its model-making sector, adhesive bonding is being used more and more extensively to join components. This applies in particular to the bodywork of motor vehicles and/or aircraft. It is in some cases very difficult and expensive, however, to separate (for example for repair purposes) components adhesively bonded to one another, in particular to separate windshields from motor vehicle bodies. Adhesive bonds whose bonding surfaces have a complex geometry are also difficult. Since adhesive bonds are separated, for example, with knives, scrapers, or wires, these operations are moreover also hazardous in terms of injury. In specific cases, for example if the geometry of the adhesive join is complex, wires are currently also used in many cases.
SUMMARY OF THE INVENTION
It is an object of the invention to make available methods and apparatuses with which components adhesively bonded to one another can be separated in as simple and economical a fashion as possible, even if the geometry of the join surfaces is complex.
The present invention provides a method for separating components adhesively bonded to one another, wherein a transmitter for mechanical vibrations, in particular for ultrasound, is placed in the region of the adhesive join; by way of the transmitter, the adhesive bond is acted upon by the vibrations, in particular by the ultrasound; that the vibrations cause excitation of the adhesive and/or of at least one of the components joined with the adhesive; and that as a result of the vibrations, the adhesive effect of the join is at least reduced in the region of the interface between the adhesive and a component and/or between the transmitter and the adhesive.
The application to the adhesive join of mechanical vibrations, in particular vibrations in the form of ultrasound, and of electromagnetic radiation, in particular laser radiation, results in premature aging and thus fatiguing of the adhesive join. Fatiguing of the adhesive join can result, for example, from a change in the chemical and/or physical structure of the adhesive. Because of this fatiguing, the join is then at least easier to detach. The invention thus makes it possible, inter alia, to save time and expense. In addition, it also makes it possible to separate adhesively bonded components conveniently and at least with less risk to the worker.
In particular, the exciting frequency of the vibration or the radiation is matched to the adhesive being used in such a way that the reduction in adhesive effect can be achieved as quickly as possible. The reduction in adhesive effect preferably occurs at different interfaces depending on the material combinations and/or selected frequency of the vibration or radiation.


REFERENCES:
patent: 3719543 (1973-03-01), Harris
patent: 4248232 (1981-02-01), Engelbrecht et al.
patent: 4868237 (1989-09-01), Hoff et al.
patent: 5100494 (1992-03-01), Schmidt
patent: 5123902 (1992-06-01), Muller et al.
patent: 5163933 (1992-11-01), Grundfest
patent: 5221282 (1993-06-01), Wuchinich
patent: 5269868 (1993-12-01), Gofuku et al.
patent: 5296083 (1994-03-01), Petino
patent: 5358505 (1994-10-01), Wuchinich
patent: 5382251 (1995-01-01), Hood et al.
patent: 5413578 (1995-05-01), Zahedi
patent: 5421943 (1995-06-01), Tam et al.
patent: 5807383 (1998-09-01), Kolesa et al.
patent: 5840075 (1998-11-01), Mueller et al.
patent: 5895589 (1999-04-01), Rogers et al.
patent: 5976955 (1999-11-01), Hodges
patent: 6558493 (2003-05-01), Ledger et al.
patent: 2001/0042387 (2001-11-01), Ikushima et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods and apparatuses for detaching components adhesively... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatuses for detaching components adhesively..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatuses for detaching components adhesively... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3227971

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.