Methods and apparatuses for conditioning polishing surfaces...

Details Methods and apparatuses for conditioning polishing surfaces... Methods and apparatuses for conditioning polishing surfaces...

2005-10-11

2005-10-11

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S009000, C451S011000, C451S056000, C451S443000

Reexamination Certificate

active

06953382

ABSTRACT:
Methods and apparatus are provided for conditioning of polishing surfaces utilized during CMP processing. The method comprises contacting the polishing surface and a conditioning surface with a first force, one of the surfaces coupled to a support member that has an axis. The polishing surface and/or the conditioning surface is moved at a constant velocity. Torque exerted by the support member about the axis to effect a relative position between the conditioning surface and the polishing surface is measured and used to obtain a process variable. The process variable is compared to a setpoint value for the relative position of the conditioning surface and the polishing surface. A second force is calculated and the polishing surface and the conditioning surface then are contacted with the second force, if the process variable differs from the setpoint value by more than an allowed tolerance.

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patent: 2000-61812 (2000-02-01), None

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