Methods and apparatuses for applying wafer-alignment marks

Details Methods and apparatuses for applying wafer-alignment marks Methods and apparatuses for applying wafer-alignment marks

2007-08-14

2007-08-14

Matthews, Alan (Department: 2851)

Photocopying

Projection printing and copying cameras

Step and repeat

C355S067000, C356S399000, C356S401000

Reexamination Certificate

active

10692494

ABSTRACT:
Embodiments of the invention provide methods and apparatuses for efficient and cost-effective imaging of alignment marks. For one embodiment, alignment mark imaging is accomplished separately from, and independent of product imaging through use of a relatively low cost, low resolution, imaging tool. For one embodiment a wafer is exposed to low-resolution light source through a reticle having a number of alignment patterns corresponding to desired alignment marks. For one embodiment, global alignment marks are imaged on a backside of a wafer. Various embodiments of the invention obviate the need for a highly accurate stage and a high-resolution imaging device, and therefore reduce processing costs and processing time.

REFERENCES:
patent: 5094539 (1992-03-01), Komoriya et al.
patent: 5463200 (1995-10-01), James et al.
patent: 5861944 (1999-01-01), Nishi
patent: 5912726 (1999-06-01), Toguchi et al.
patent: 2003/0117604 (2003-06-01), Kobayashi et al.
Annex to Form PCT/ISA/206, Communication Relating to the Results of the Partial International Search, Feb. 24, 2005, 3 pages.
International Preliminary Report on Patentability, Chapter 1, PCT/US2004/031627, mailed May 4, 2006.

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