Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate
2007-12-31
2011-10-25
Tucker, Philip (Department: 1745)
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
C264S271100, C264S271100, C264S271100, C264S279100, C425S572000, C425S116000, C425S111000, C425S125000
Reexamination Certificate
active
08043545
ABSTRACT:
Methods and apparatus to evenly clamp semiconductor substrates in a transfer mold process are disclosed. A disclosed split mold base includes a first plate having a first surface, a second plate having a second surface opposite the first surface, and a plurality of springs that are disposed between the first and second plates to distribute a clamping pressure applied by a mold press.
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“Semiconductor Packaging Assembly Technology,” National Semiconductor, Aug. 1999 (8 pages).
Murugan Selvarajan
Rafaie Abdul Rahman Mohamed
Brady III Wade J.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tucker Philip
Tung Yingsheng
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