Methods and apparatus for thermally coupling a heat sink to...

Details Methods and apparatus for thermally coupling a heat sink to... Methods and apparatus for thermally coupling a heat sink to...

2006-03-28

2006-03-28

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C174S016300, C257S718000, C257S719000, C361S710000, C361S719000

Reexamination Certificate

active

07019976

ABSTRACT:
A heat sink has a flexure member attached to a base of the heat sink and located between the base and an associated circuit board component. As the heat sink attaches to a circuit board carrying the circuit board component, the flexure member conforms to the surface of the circuit board component, thereby thermally contacting the circuit board component. The flexure member absorbs local tolerance differences on the circuit board component to provide a relatively uniform stress across the surface of the circuit board component. The flexure member further limits the amount of stress generated by the heat sink on the circuit board component. When used in conjunction with a heat sink spanning several circuit board components, the flexure member absorbs global tolerance differences among the circuit board components, thereby providing relatively uniform stresses to all of the circuit board components and limiting the amount of stress experienced by any one circuit board component.

REFERENCES:
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patent: 6714416 (2004-03-01), McLeod et al.
patent: 6728104 (2004-04-01), Ahmad et al.
patent: 6856511 (2005-02-01), Viernes et al.

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