Methods and apparatus for the in-process detection of workpieces

Details Methods and apparatus for the in-process detection of workpieces Methods and apparatus for the in-process detection of workpieces

1997-07-10

1998-11-10

Larkin, Daniel S.

Measuring and testing

Surface and cutting edge testing

Roughness

738658, G01B 528

Patent

active

058346457

ABSTRACT:
An apparatus for detecting the presence of extraneous material on a polishing pad during a chemical mechanical planarization (CMP) process uses a contact probe assembly. The contact probe assembly interrogates the surface of the polishing pad during processing of a workpiece and generates a control signal indicating the presence of extraneous material when the displacement of a contact stylus exceeds a threshold amount. The contact probe assembly produces a control signal in response to the detection of extraneous material and the control signal causes the CMP system to react in an appropriate manner to reduce damage to the workpieces being processed.

REFERENCES:
patent: 5184503 (1993-02-01), Hancock
patent: 5531632 (1996-07-01), Mizutani
Excerpt from OMRON Manual-Contact Linear Displacement Sensor D5M, pp. 88-94 .

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