Methods and apparatus for the detection of damaged regions...

Details Methods and apparatus for the detection of damaged regions... Methods and apparatus for the detection of damaged regions...

2005-07-19

2005-07-19

Clark, S. V. (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including contaminant removal or mitigation

C438S015000

Reexamination Certificate

active

06919228

ABSTRACT:
Techniques for detecting damage on an integrated circuit die using a particle suspension solution are disclosed. The particles of the suspension solution preferentially attach to damaged regions on exposed dielectric films or other portions of the die. For example, one aspect of the invention is a method of detecting damage to a dielectric film used in fabricating a die of an integrated circuit. A particle suspension solution is applied to the die and damaged regions of the dielectric film are identified as areas having an accumulation of particles of the particle suspension solution.

REFERENCES:
patent: 5971586 (1999-10-01), Mori
patent: 6544862 (2003-04-01), Bryan
patent: 6736922 (2004-05-01), Obregon et al.
patent: 2003/0213614 (2003-11-01), Furusawa et al.

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