Methods and apparatus for the chemical mechanical...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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C451S285000

Reexamination Certificate

active

07083501

ABSTRACT:
Method and apparatus for chemically and mechanically planarizing the surface of a silicon wafer which includes a compressible non-cellualar lapping surface and a slurry disposed between the wafer and the lapping surface.

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Bajaj, R. et al., Materials Research Society Symposium Proceedings, vol. 337, Effect of Polish Pad Material Properties on Chemical Mechanical Polishing (CMP) Processes, Apr. 4, 1994, pp. 637-644.

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