Methods and apparatus for soldering without using flux

Details Methods and apparatus for soldering without using flux Methods and apparatus for soldering without using flux

1992-09-18

1993-03-16

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228205, 228254, 228 62, 228 33, 21912185, B23K 308, B23K 2600

Patent

active

051937387

ABSTRACT:
Metallic surfaces are soldered together without using flux or solvents. The metallic surfaces are maintained in an atmosphere of inert gas and cleaned with a laser. An ejection device deposits drops of liquid solder on a predetermined one of the metallic surfaces and the metallic surfaces are moved relative to each other so that the solidified solder contacts the other metallic surface. The metallic surfaces and the solidified solder are then heated until the solidified solder reflows and joins the metallic surfaces.

REFERENCES:
patent: 4337886 (1982-07-01), King et al.
patent: 4423120 (1983-12-01), Paulus et al.
patent: 5090609 (1992-02-01), Nakao et al.

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