Methods and apparatus for rinsing and drying

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

Reexamination Certificate

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C438S750000, C134S001200, 15

Reexamination Certificate

active

07429537

ABSTRACT:
A method for rinsing and drying a workpiece includes placing the workpiece into a chamber and spinning the workpiece. A rinsing fluid, such as water, is applied onto the workpiece through a first outlet in the chamber, with the rinsing fluid moving outwardly towards the edge of the workpiece via centrifugal force, to rinse the workpiece. A drying fluid, such as an alcohol vapor, is applied onto the workpiece through the first outlet, with the drying fluid moving outwardly towards the edge of the workpiece via centrifugal force, to dry the workpiece. The drying fluid advantageously follows a meniscus of the rinsing fluid across the workpiece surface. The rinsing fluid, or the drying fluid, or both fluids, may be applied near or at a central area of the workpiece.

REFERENCES:
patent: 4788994 (1988-12-01), Shinbara
patent: 4871417 (1989-10-01), Nishizawa et al.
patent: 5271774 (1993-12-01), Leenaars et al.
patent: 5660642 (1997-08-01), Britten
patent: 6077412 (2000-06-01), Ting et al.
patent: 6247479 (2001-06-01), Taniyama et al.
patent: 6491764 (2002-12-01), Mertens et al.
patent: 6754980 (2004-06-01), Lauerhaas et al.
patent: 409038595 (1997-02-01), None
patent: 10335298 (1998-12-01), None

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