Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
1999-12-20
2001-06-12
Riley, Shawn (Department: 2838)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
Reexamination Certificate
active
06245995
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates generally to enclosures and, more particularly, to enclosures that include a potting compound covering a control board.
Often control boards including electronic components are mounted within enclosures which protect the control board from direct exposure to environmental conditions. However, when the enclosures are used in outdoor applications, often the changing environmental conditions can create condensation within the enclosure. Such moisture may damage the control board and the electronic components leading to a failure of the control board or an associated device electrically connected to the control board.
Known enclosures include small drain holes to permit moisture to drain from the enclosure. Additionally a potting material is poured within the enclosure over the control board to provide additional protection from moisture. Because the electronic components vary between control boards, the level of potting material used varies between enclosures. As the level of potting material changes, often the position of the small drain holes permitted the potting material to overflow through the holes and plug the holes. Other drain hole locations permit too much moisture to accumulate on a top surface of the potting material before permitting the moisture accumulation to drain from the enclosures, thus increasing the risk of the moisture damaging the control board.
BRIEF SUMMARY OF THE INVENTION
In an exemplary embodiment, an enclosure includes a control board, an opening to permit moisture to drain from the enclosure, and a potting compound to protect the control board mounted within the enclosure. When cured, a channel is formed within the potting compound extending from a top surface of the potting material to the opening. The opening extends through a side wall of the enclosure and is sized to receive a plug. The plug is sized to fit in sealable contact within the opening.
During assembly, the control board is mounted within the enclosure such that an edge of the control board is positioned a height from a bottom of the enclosure that is between a top and a bottom of the opening. The plug is inserted within the opening and seals the opening. When the potting compound is placed within the enclosure, the control board and a portion of the plug are covered with the potting compound. After the potting compound is cured, the plug is removed leaving a drainage channel extending through the potting compound to the opening.
REFERENCES:
patent: 5096427 (1992-03-01), Sadigh-Behzadi
patent: 5381304 (1995-01-01), Theroux et al.
patent: 5689089 (1997-11-01), Polak et al.
Coorod Scott
Lytle Peter B.
Wright Kamron M.
Young Glen
Armstrong Teasdale LLP
General Electric Company
Horton Esq. Carl B.
Riley Shawn
Wasserbauer Esq. Damian
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