Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-12-04
2007-12-04
Louie, Wai-Sing (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S109000, C438S612000, C438S614000
Reexamination Certificate
active
10799479
ABSTRACT:
An area array device has a grid array of primary electrical contacts coupled to a coupling surface of the device and configured to carry data signals between the area array package and a circuit board. The area array device also has an additional series of secondary electrical contacts coupled to the coupling surface of the device and configured to carry power signals between the area array package and the circuit board. The additional series of secondary electrical contacts provides a relatively large amount of power to the area array package while allowing a manufacturer to maintain the number of primary electrical contacts of the grid array configured to carrying data signals and therefore maintain the overall performance of the area array package.
REFERENCES:
patent: 3871015 (1975-03-01), Lin et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5701032 (1997-12-01), Fischer et al.
patent: 5748456 (1998-05-01), Bayerer
patent: 5757078 (1998-05-01), Matsuda et al.
patent: 5760478 (1998-06-01), Bozso et al.
patent: 5828128 (1998-10-01), Higashiguchi et al.
patent: 6147401 (2000-11-01), Solberg
patent: 6396136 (2002-05-01), Kalidas et al.
patent: 6437439 (2002-08-01), Shimoe
patent: 6444563 (2002-09-01), Potter et al.
patent: 6452113 (2002-09-01), Dibene, II et al.
patent: 6476503 (2002-11-01), Imamura et al.
patent: 6477046 (2002-11-01), Stearns et al.
patent: 6525275 (2003-02-01), Asai
patent: 6552436 (2003-04-01), Burnette et al.
patent: 6584596 (2003-06-01), Buffet et al.
patent: 6597593 (2003-07-01), Cruz et al.
patent: 6600220 (2003-07-01), Barber et al.
patent: 6627822 (2003-09-01), Jackson et al.
patent: 6657311 (2003-12-01), Hortaleza et al.
patent: 6674166 (2004-01-01), Rao et al.
patent: 6750135 (2004-06-01), Elenius et al.
patent: 6750549 (2004-06-01), Chandran et al.
patent: 6770963 (2004-08-01), Wu
patent: 6773269 (2004-08-01), Downes
patent: 6787920 (2004-09-01), Amir
patent: 6867502 (2005-03-01), Katagiri et al.
patent: 6897555 (2005-05-01), Lim et al.
patent: 6927346 (2005-08-01), McCormick et al.
Hubbard Kenneth
Xue Jie
Yang Zhiping
Zou Yida
BainwoodHuang
Louie Wai-Sing
LandOfFree
Methods and apparatus for providing a power signal to an... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods and apparatus for providing a power signal to an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for providing a power signal to an... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3841672