Optics: measuring and testing – Dimension – Thickness
Reexamination Certificate
2006-09-05
2006-09-05
Smith, Zandra V. (Department: 2877)
Optics: measuring and testing
Dimension
Thickness
C156S345150, C156S345240, C118S712000
Reexamination Certificate
active
07102763
ABSTRACT:
A method and apparatus for processing a microelectronic workpiece using metrology. The apparatus can include one or more processing or transport units, a metrology unit, and a control unit coupled to the metrology unit and at least one of the processing or transport units. The control unit can modify a process recipe or a process sequence of the processing unit based on a feed forward or a feed back signal from the metrology unit. The control unit can also provide instructions to the transport unit to move the workpiece to a selected processing unit. The processing unit can include, inter alia, a seed layer deposition unit, a process layer electrochemical deposition unit, a seed layer enhancement unit, a chemical mechanical polishing unit, and/or an annealing chamber arranged for sequential processing of a workpiece. The processing units can be controlled as an integrated system using one or more metrology units, or a separate metrology unit can provide input to the processing units.
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Aegerter Brian
Dundas Curt
Eudy Steve L.
McHugh Paul R.
Peace Steven L.
Perkins Coie LLP
Semitool Inc.
Smith Zandra V.
LandOfFree
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