Methods and apparatus for printing conductive thickfilms...

Details Methods and apparatus for printing conductive thickfilms... Methods and apparatus for printing conductive thickfilms...

2006-03-21

2006-03-21

Norton, Nadine G. (Department: 1765)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S095000, C216S096000, C029S846000, C029S847000

Reexamination Certificate

active

07014784

ABSTRACT:
In one embodiment, a plurality of thickfilm dielectric layers are printed on a substrate, with each successive layer being printed over a previous layer, and with each layer having sloped walls. After printing a first subset of the plurality of thickfilm dielectric layers, a first conductive thickfilm is printed over at least the walls of the first subset of dielectric layers. Then, after printing a second subset of the plurality of thickfilm dielectric layers, a second conductive thickfilm is printed over the second subset of dielectric layers (with the first and second conductive thickfilms being electrically coupled).

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Casey, et al., “Methods for Forming a Conductor on a Dielectric”, U.S. Appl. No. 10/601,042, filed Jun. 19, 2003.

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