Methods and apparatus for polishing a semiconductor wafer

Details Methods and apparatus for polishing a semiconductor wafer Methods and apparatus for polishing a semiconductor wafer

2007-05-30

2010-11-02

Rose, Robert (Department: 3727)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S173000, C451S011000

Reexamination Certificate

active

07824244

ABSTRACT:
Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and a plurality of actuators, at least two of which are independently controllable, located with respect to the base and the moving belt such that a corresponding plurality of pressure zones are defined to provide pressure between the moving belt and the top surface of the substrate.

REFERENCES:
patent: 4850152 (1989-07-01), Heynacher et al.
patent: 5472374 (1995-12-01), Yamada
patent: 5558568 (1996-09-01), Talieh et al.
patent: 6325696 (2001-12-01), Boggs et al.
patent: 6607425 (2003-08-01), Kistler et al.
patent: 6769970 (2004-08-01), Taylor et al.
patent: 6786810 (2004-09-01), Muilenburg et al.
patent: 6875085 (2005-04-01), Weldon et al.
patent: 7431634 (2008-10-01), Lee
patent: 2004/0023606 (2004-02-01), Wang et al.
patent: 2005/0054266 (2005-03-01), Togawa
“3M SlurryFree CMP Fixed Abrasives for Direct HDP STI CMP,” JJ Gagliardi, Lead Applications Development Specialts, Technical Brief (Jul. 2003) pp. 1-8.
“Customer Specification,” 3M, Nov. 23, 2004 pp. 1-4.
“3M Electonic Lapping with Trizact Diamond Tile,” Indusctrial Business Electronics Markets Materials Division, No. 60-5002-0018-7 pp. 1-2.

Affiliated with

Also associated with

Rating

Methods and apparatus for polishing a semiconductor wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatus for polishing a semiconductor wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for polishing a semiconductor wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4206710