Methods and apparatus for plasma treatment of workpieces

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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118719, 118723E, 118729, 118730, H05H 100

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active

057664048

ABSTRACT:
Methods and apparatus for plasma treatment of workpieces in which the apparatus includes a reaction chamber having a door through which a magazine loaded with workpieces and an empty magazine can be manually or robotically placed on a shelf in the reaction chamber, and associated apparatus for striking and maintaining a plasma in the reaction chamber, the shelf being provided with stops for maintaining both magazines in alignment so that the workpieces can be pushed out of the loaded magazine, across a gap between the magazines, and into the empty magazine while plasma exists in the gap, and pushing apparatus for pushing workpieces from the loaded magazine, across the gap, and into the empty magazine, and the method of plasma treatment carried out by this apparatus. In one version the pushing apparatus pushes all of the workpieces from magazine to magazine at once. In another version, a subplurality of the workpieces in the loaded magazine is pushed across the gap and into the empty magazine at one time.

REFERENCES:
patent: 4318767 (1982-03-01), Hijikata
patent: 4550242 (1985-10-01), Uehara et al.
patent: 4575299 (1986-03-01), Layton
patent: 4584045 (1986-04-01), Richards
patent: 4705444 (1987-11-01), Tullis et al.
patent: 4816116 (1989-03-01), Davis
patent: 5079031 (1992-01-01), Yamazaki et al.
patent: 5116640 (1992-05-01), Mikami et al.
patent: 5259942 (1993-11-01), Kempf
patent: 5286296 (1994-02-01), Sato
patent: 5288684 (1994-02-01), Yamazaki et al.
patent: 5292393 (1994-03-01), Maydan
patent: 5302077 (1994-04-01), Sato
patent: 5310410 (1994-05-01), Begin
patent: 5314298 (1994-05-01), Kim
patent: 5387265 (1995-02-01), Kakizaki et al.
patent: 5515986 (1996-05-01), Turlot et al.

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