Methods and apparatus for modular computer construction

Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition

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361800, H05K 900

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active

053491327

ABSTRACT:
A modular enclosure for personal computer systems, and methods for assembly of an enclosure. The enclosure substantially comprises a base, a unitary internal frame, a front and a back panel, and a U-shaped top cover. Frame-mounting snaps and cruciform members located on forward and rear portions of the frame mate to complimentary receiving openings in the base. Front and rear panels are mounted to the base, frame, and top cover by a plurality of panel-mounting snaps and hooks. A base electromagnetic interference (EMI) shield at the periphery of the shield having a plurality of planar tabbed fingers with hemispherical domes formed therein is then fitted and secured to the base such that the lateral edges of the fingers are recessed below a peripherally extending rim on the base. Thereafter, the internal frame is snapped into place upon the base, and a rear panel having an EMI shield fitted and secured to the base and frame by panel-mounting snaps and hooks. A front panel having a front EMI shield is then mounted and secured to the top cover. The top cover assembly is then lowered onto the base-frame assembly and slideably moved rearward until the rear edges of the top cover assembly contact a plurality of contact fingers formed in the rear EMI shield, the top cover assembly resting upon on the domes of the base EMI shield.

REFERENCES:
patent: 4728160 (1988-03-01), Mondor et al.
patent: 4821146 (1989-04-01), Behrens et al.
patent: 4899254 (1990-02-01), Ferchau et al.
patent: 5014160 (1991-05-01), McCoy, Jr.
patent: 5067041 (1991-11-01), Cooke et al.

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