Metal working – Method of mechanical manufacture – Electrical device making
Patent
1998-04-03
1999-07-20
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
257675, 257707, 257796, 438118, 438122, H02R 4300
Patent
active
059241900
ABSTRACT:
Methods and apparatuses for encapsulating thermally enhanced (TE) and electrically and thermally enhanced (ETE) integrated circuit assemblies that include bulky thermally conductive heat sinks so as to prevent the formation of pinholes and IC warpage without adding bulk or additional structures. The assemblies are repositioned, through offset in the bonding fingers of the leadframe, so that the rates of mold flow in the two halves of the mold cavity are substantially balanced. The repositioning of the assemblies also substantially balances the amount of mold material in the mold halves to prevent warpage when the IC cools down.
REFERENCES:
patent: 4891333 (1990-01-01), Baba et al.
patent: 4975761 (1990-12-01), Chu
patent: 5159750 (1992-11-01), Dutta et al.
patent: 5188985 (1993-02-01), Medeiros et al.
patent: 5202288 (1993-04-01), Doering et al.
patent: 5210598 (1993-05-01), Nakazaki et al.
patent: 5331511 (1994-07-01), Lee et al.
patent: 5493146 (1996-02-01), Pramanik et al.
patent: 5502315 (1996-03-01), Chua et al.
patent: 5529959 (1996-06-01), Yamanaka
patent: 5646828 (1997-07-01), Degani et al.
patent: 5686361 (1997-11-01), Ootsuki
patent: 5701034 (1997-12-01), Marrs
Chen Che-Yuan
Lee Sang S.
Arbes Carl J.
VLSI Technology Inc.
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