Methods and apparatus for maintaining electroless plating soluti

Coating processes – Measuring – testing – or indicating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427 10, 118663, 118665, 118688, 118 26, 118404, B05D 700

Patent

active

054846269

ABSTRACT:
Methods and apparatus for controlling plating rates of electroless plating solutions. The invention provides for continuous monitoring and replenishment of a one or more components of an electroless plating solution on a real time basis. The invention can be characterized in part by use of a quartz crystal microbalance.

REFERENCES:
patent: 3670693 (1972-06-01), Rorick
patent: 4061588 (1977-12-01), Gulla
patent: 4343827 (1982-08-01), Thompson
patent: 4499852 (1985-02-01), Castner
patent: 4565575 (1986-01-01), Cardin et al.
patent: 4623554 (1986-11-01), Kaschak et al.
patent: 4626446 (1986-12-01), Capwell et al.
patent: 4654126 (1987-03-01), Amelio et al.
patent: 4674440 (1987-06-01), Cardin
patent: 4707377 (1987-11-01), Capwell
patent: 4707378 (1987-11-01), McBride
patent: 4774101 (1988-09-01), Harris
R. Schumacher et al "Kinetic Analysis of Electroless Deposition of Copper" J. Phys. Chem. vol. 89, No. 20, 1985, pp. 4338-4342.
W. Hinsberg, et al., Rev. Sci, Instrum. 60(3) 489-492. (1989).
R. Schumacher, Angew. Chem. Int. Ed. Engl., vol. 29, No. 4, 329-343, (1990).
J. Thomas, J. Electrochem. Soc.: Electrochemical Science and Technology, 677-680, (1977).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods and apparatus for maintaining electroless plating soluti does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatus for maintaining electroless plating soluti, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for maintaining electroless plating soluti will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-308090

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.