Methods and apparatus for layout of multi-layer circuit...

Details Methods and apparatus for layout of multi-layer circuit... Methods and apparatus for layout of multi-layer circuit...

2011-08-09

2011-08-09

Siek, Vuthe (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Integrated circuit design processing

Physical design processing

C716S122000, C716S129000, C716S130000, C716S137000, C716S139000

Reexamination Certificate

active

07996806

ABSTRACT:
Methods and apparatus are provided for designing and laying out multi-layer circuit substrates, such as multi-layer PCBs. Dynamic vias are provided on intermediate PCB layers. Each dynamic via has features that adjust based on the trace layout of the corresponding intermediate layer. In particular, each dynamic via has a second radius R2if the via is not connected to any trace on the corresponding intermediate layer. If a trace is connected to a dynamic via, the via radius changes from the second radius R2to a first radius R1, where R1is greater than R2.

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