Methods and apparatus for integrated circuit device power...

Details Methods and apparatus for integrated circuit device power... Methods and apparatus for integrated circuit device power...

2003-11-26

2008-09-30

Ngo, Hung V (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C257S784000, C257S691000

Reexamination Certificate

active

07429703

ABSTRACT:
An integrated circuit device comprising a die having a top surface with a peripheral region and an interior region surrounded by the peripheral region. Bond pads are disposed in the peripheral region of the die. One or more internal buses are disposed in the interior region of the die. The one or more internal buses distribute power to internal node points of the die. One or more bond wires connect one or more peripheral bond pads with one or more internal buses.

REFERENCES:
patent: 5751065 (1998-05-01), Chittipeddi et al.
patent: 6727597 (2004-04-01), Taylor et al.
patent: 6770963 (2004-08-01), Wu

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