Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-01-23
2007-01-23
Datskovsky, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C257S727000, C024S625000, C165S080300
Reexamination Certificate
active
10730524
ABSTRACT:
A circuit board module includes a circuit board having surface mount pads, a circuit board component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a heat sink, a first clip holder and a second clip holder. Each clip holder is mounted to respective surface mount pads of the circuit board using a surface mount technology soldering process. The heat sink assembly further includes a clip having a first portion configured to fasten to the first clip holder, a second portion configured to fasten to the second clip holder, and a third portion coupled to the first and second portions. The third portion is configured to position the heat sink adjacent the circuit board component when the first and second portions are respectively fastened to the first and second clip holders.
REFERENCES:
patent: 4991059 (1991-02-01), Kiyose
patent: 5148349 (1992-09-01), Kogure et al.
patent: 5249977 (1993-10-01), Tanaka et al.
patent: 5270492 (1993-12-01), Fukui
patent: 5346118 (1994-09-01), Degani et al.
patent: 5640305 (1997-06-01), Smithers
patent: 5786989 (1998-07-01), Kawabe
patent: 6208517 (2001-03-01), Prince et al.
patent: 6222734 (2001-04-01), Bookhardt et al.
patent: 6552277 (2003-04-01), Downes
patent: 6590771 (2003-07-01), Sopko et al.
patent: 6623283 (2003-09-01), Torigian et al.
patent: 6714416 (2004-03-01), McLeod et al.
patent: 6775138 (2004-08-01), Lee et al.
patent: 6813155 (2004-11-01), Lo
patent: 6826051 (2004-11-01), Lai et al.
patent: 6826054 (2004-11-01), Liu
patent: RE38677 (2004-12-01), Blomquist
patent: 6829144 (2004-12-01), Stutzman et al.
patent: 6835898 (2004-12-01), Eldridge et al.
patent: 6856511 (2005-02-01), Viernes et al.
Huynh Hong
King Anthony
Narasimhan Susheela
BainwoodHuang
Cisco Technology Inc.
Datskovsky Michael
Hoffberg Robert J.
LandOfFree
Methods and apparatus for installing a heat sink using... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods and apparatus for installing a heat sink using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for installing a heat sink using... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3795881