Methods and apparatus for forming a cohesive backplane...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C385S088000, C385S014000, C385S053000

Reexamination Certificate

active

07102893

ABSTRACT:
An assembly couples first and second backplanes together. The first backplane is configured to carry first electrical backplane signals among a first set of circuit boards. The second backplane is configured to carry second electrical backplane signals among a second set of circuit boards. The assembly includes a first switch configured to convey at least some of the first electrical backplane signals between circuit boards of the first set of circuit boards. The assembly further includes a second switch configured to convey at least some of the second electrical backplane signals between circuit boards of the second set of circuit boards. The assembly further includes a fiber optic cable joining the first and second switches together. The first and second switches are configured to exchange fiber optic signals through the fiber optic cable thus forming a cohesive backplane interconnect system between the first and second sets of circuit boards.

REFERENCES:
patent: 6600853 (2003-07-01), Wickman et al.
patent: 6623177 (2003-09-01), Chilton
patent: 6661940 (2003-12-01), Kim
patent: 6694068 (2004-02-01), Parker
patent: 6762362 (2004-07-01), Cavanaugh et al.
patent: 2003/0210869 (2003-11-01), Doorn

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