Methods and apparatus for electroplating electrical contacts

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

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C25D 502

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active

052718220

ABSTRACT:
A method for selectively electroplating a metallic coating, such as solder, onto a plurality of small and closely spaced electrical contacts. The method includes sealingly enclosing the contacts in an electroplating cell having an anode, a cathode and a chamber, forming an electrical connection between the cathode and the contacts and electroplating the contacts.

REFERENCES:
patent: 4810343 (1989-03-01), Bonnardel
patent: 5032234 (1991-07-01), Oku et al.
"Hunter Mini-Plating Pens Ultra-Compact Electro Plating System With Marker Pen Convenience," Hunter Products, Inc. Bridgewater, NJ, pp. 1-4.
"Enthone-OMI SEL-REX," Enthone-OMI, Inc., New Haven, CT Mar. 1987, pp. 1-8.
"Carousel Data 35/22," S. G. Owen Ltd., Philadelphia, PA, pp. 1-2.
"Flip-Top Data 35/25", S. G. Owen Ltd., Philadelphia, PA. pp. 1-2.
"Mini-Lab Data 34/23," S. G. Owen Ltd., Philadelphia, PA, pp. 1-2.

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