Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – With mechanical abrasion or grinding
Reexamination Certificate
2006-12-27
2009-11-17
Wilkins, III, Harry D. (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic erosion of a workpiece for shape or surface...
With mechanical abrasion or grinding
C205S663000, C204S199000
Reexamination Certificate
active
07618528
ABSTRACT:
Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus in accordance with one embodiment includes a support member configured to releasably carry a microelectronic substrate and first and second electrodes spaced apart from each other and from the microelectronic substrate. A polishing medium is positioned between the electrodes and the support member and has a polishing surface positioned to contact the microelectronic substrate. At least a portion of the first and second electrodes can be recessed from the polishing surface. A liquid, such as an electrolytic liquid, can be provided in the recess, for example, through flow passages in the electrodes and/or the polishing medium. A variable electrical signal is passed from at least one of the electrodes, through the electrolyte and to the microelectronic substrate to remove material from the substrate.
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Lee Whonchee
Meikle Scott G.
Moore Scott E.
Micro)n Technology, Inc.
Perkins Coie LLP
Smith Nicholas A.
Wilkins, III Harry D.
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