Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-03-22
2011-03-22
Lea-Edmonds, Lisa (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679080, C361S679460, C361S690000, C361S692000, C165S080300, C165S080400, C165S104330, C165S104340
Reexamination Certificate
active
07911780
ABSTRACT:
An electronic device can be provided with a user interface component and a cooling component contained within a housing. The housing may include at least one surface having an opening formed therethrough, and the user interface may include one port formed therethrough. The user interface port may provide at least a first portion of a passageway between the housing opening and the cooling component. The passageway may allow fluids to be exchanged between the cooling component and the housing opening for cooling the electronic device.
REFERENCES:
patent: 5251096 (1993-10-01), Hosoi et al.
patent: 6157537 (2000-12-01), Cheng
patent: 6253838 (2001-07-01), Fiechter et al.
patent: 6327144 (2001-12-01), May
patent: 6859364 (2005-02-01), Yuasa et al.
patent: 7164580 (2007-01-01), DiStefano
patent: 2002/0085350 (2002-07-01), Ghosh
patent: 2004/0190243 (2004-09-01), DiStefano
patent: 2005/0093721 (2005-05-01), Shipman
patent: 2005/0111189 (2005-05-01), Smalc et al.
patent: 2006/0227503 (2006-10-01), Ho et al.
Ali Ihab A.
Rihn Bernard K.
Apple Inc.
Edwards Anthony Q
Kramer Levin Naftalis & Frankel LLP
Lea-Edmonds Lisa
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