Methods and apparatus for controlled-angle wafer positioning

Details Methods and apparatus for controlled-angle wafer positioning Methods and apparatus for controlled-angle wafer positioning

2006-08-29

2006-08-29

Wong, Edna (Department: 1753)

Material or article handling

Process

Of reorienting article

C414S935000, C414S936000, C205S080000

Reexamination Certificate

active

07097410

ABSTRACT:
The orientation of a wafer with respect to the surface of an electrolyte is controlled during an electroplating process. The wafer is delivered to an electrolyte bath along a trajectory normal to the surface of the electrolyte. Along this trajectory, the wafer is angled before entry into the electrolyte for angled immersion. A wafer can be plated in an angled orientation or not, depending on what is optimal for a given situation. Also, in some designs, the wafer's orientation can be adjusted actively during immersion or during electroplating, providing flexibility in various electroplating scenarios.

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