Methods and apparatus for control of polishing pad conditioning

Details Methods and apparatus for control of polishing pad conditioning Methods and apparatus for control of polishing pad conditioning

1996-09-04

1997-09-09

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

451 5, 451 41, 451 56, 451287, 451443, 451444, B24B 4900

Patent

active

056649878

ABSTRACT:
A method and apparatus for determining the amount of conditioning required to be applied to a polishing pad to achieve a desired removal rate during the polishing of a semiconductor wafer utilizes a rotating conditioning wheel in contact with a rotating polishing pad. Preselected points on just polished wafers are measured for removal rate and such measurements are used to calculate the removal rate as a function of wafer radius. When the removal rate changes by a preselected amount, the polishing pad is conditioned in accordance with the calculations.

REFERENCES:
patent: 34425 (1862-11-01), Schultz
patent: 4999954 (1991-03-01), Miyamoto et al.
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5308438 (1994-05-01), Cote et al.
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5433650 (1995-07-01), Winebarger
GAARD Automation Flexible Automations Systems, Gaard Pad Conditioning Arm (no date).
Design News, Aug. 2, 1993, vol. 48/No. 15 cover page; pp. 5, 171, 81-84.
Fifteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium Proceedings 1993 IEMT Symposium--Oct. 4-6, 1993, Santa Clara, CA USA cover pg; pp. ix, 235-239.

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