Methods and apparatus for chemical mechanical planarization (CMP

Details Methods and apparatus for chemical mechanical planarization (CMP Methods and apparatus for chemical mechanical planarization (CMP

1998-03-06

2000-02-01

Utech, Benjamin

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438692, 438693, H01L 21302

Patent

active

060202629

ABSTRACT:
Areas of different temperatures are provided on a semiconductor wafer to improve uniformity in polishing rates during CMP.

REFERENCES:
patent: 4450652 (1984-05-01), Walsh
patent: 5196353 (1993-03-01), Sandhu et al.
patent: 5643060 (1997-07-01), Sandhu et al.
patent: 5700180 (1997-12-01), Sandhu et al.
patent: 5762537 (1998-06-01), Sandhu et al.
patent: 5842909 (1998-12-01), Sandhu et al.

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