Methods and apparatus for assembling a printed circuit board

Details Methods and apparatus for assembling a printed circuit board Methods and apparatus for assembling a printed circuit board

2005-10-31

2009-12-29

Lin, Kuang Y (Department: 1793)

Metal fusion bonding

Process

Applying or distributing fused filler

C228S037000, C228S180100, C029S841000

Reexamination Certificate

active

07637415

ABSTRACT:
A method for manufacturing a printed circuit board includes providing a board including a plurality of electrical traces, a first surface, and a second surface opposite the first surface. The method further includes providing at least one surface mount component having a plurality of electrical terminals. The method also includes applying an adhesive on the first surface of the board, and adhering the surface mounting component to the first surface. The method also includes wave soldering the surface mount component on the first surface to the board to encapsulate at least a portion of the electrical terminals of the surface mount component with a lead-free solder.

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