Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2006-01-31
2006-01-31
Zarneke, David A. (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
Reexamination Certificate
active
06991969
ABSTRACT:
A conductor carrier provides, separately manufactured, conductive pathways, on a wafer level, which may be coupled to a wafer of fully fabricated integrated circuits. Such conductor carriers include an insulating body having two major surfaces with conductors disposed on each of those surfaces, and conductors disposed within the insulating body so as to provide signal continuity between various conductors on each of the two surfaces. An assembly can be formed by permanently or removably attaching the conductor carrier to the wafer. Conductor carriers may include an evacuation pathway suitable for removing air, or other gases, from between the conductor and the wafer so as to create a pressure differential that urges the conductor carrier into contact with the wafer. Conductor carriers may include a groove which is suitable for receiving a sealing ring; and may include a street map which is suitable for providing guidance to a wafer sawing operation.
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Octavian Scientific, Inc.
Werner & Axenfeld, LLP
Zarneke David A.
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