Methods and apparatus for a Quad Flat No-Lead (QFN) package

Details Methods and apparatus for a Quad Flat No-Lead (QFN) package Methods and apparatus for a Quad Flat No-Lead (QFN) package

2006-10-31

2009-02-10

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S778000

Reexamination Certificate

active

07489026

ABSTRACT:
Methods and apparatus are provided for decreasing the size of Quad Flat No-Lead (QFN) packages (300, 400) down to chip-scale packages. Such QFN packages include a first semiconductor chip (310, 410), a plurality of recessed leads (306, 406, 408, 411) having mold lock features, and a mold material340, 440substantially encasing all sides of the semiconductor chip. An active surface (314, 414) of the semiconductor chip is oriented toward a mounting side (307, 407) of the QFN package, and a plurality of wire bonds330, 430disposed between the active surface and the mounting side couple the active side to the leads. The QFN packages may also include a second semiconductor chip (452) coupled to a plurality of leads (408) and to the first semiconductor chip via wire bonds (431, 432) in a manner similar to the first semiconductor chip.

REFERENCES:
patent: 5363279 (1994-11-01), Cha
patent: 5428247 (1995-06-01), Sohn et al.
patent: 5583375 (1996-12-01), Tsubosaki et al.
patent: 5648680 (1997-07-01), Ogawa et al.
patent: 6018191 (2000-01-01), Murakami et al.
patent: 6054753 (2000-04-01), Inaba
patent: 6075284 (2000-06-01), Choi et al.
patent: 6225558 (2001-05-01), Hur
patent: 6427976 (2002-08-01), Huang et al.
patent: 6590281 (2003-07-01), Wu et al.
patent: 6962829 (2005-11-01), Glenn et al.

Affiliated with

Also associated with

Rating

Methods and apparatus for a Quad Flat No-Lead (QFN) package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatus for a Quad Flat No-Lead (QFN) package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for a Quad Flat No-Lead (QFN) package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4138136