Methods and apparatus for a full width ultrasonic bonding device

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156290, 1563084, 156553, 156554, 156555, 1565801, 1565802, 264444, 4251742, B32B 3100

Patent

active

058171991

ABSTRACT:
This invention relates to apparatus and methods for fabricating a web or consolidating web precursor material in fabricating a web. The invention comprises ultrasonic bonding apparatus including an anvil roll receiving web materials thereon and receiving first and second rotary ultrasonic horns. The rotary ultrasonic horns, in combination with the anvil roll, ultrasonically bond segments of e.g. first and second webs to each other. Third and fourth rotary ultrasonic horns spaced about the circumference of the anvil roll, in combination with the anvil roll, ultrasonically bond other segments of the webs to each other. The full widths of the webs can be ultrasonically bonded using the rotary ultrasonic horns. An outer surface of the anvil roll preferably carries a bonding pattern defining the locations where bonding of the webs occurs. Additional e.g. third and fourth webs can be bonded by the ultrasonic bonding apparatus. Such bonding can occur after first and second webs have been bonded to each other by first and second rotary ultrasonic horns. In some instances, the third and fourth rotary ultrasonic horns can ultrasonically bond portions of the first and second webs that have already been bonded together by one or both of the first and second rotary ultrasonic horns. In other embodiments, multiple repeat bonding of substantially the same segment of the web can occur. In still other embodiments, a batt of bondable material such as fibers can be consolidated by ultrasonic bonding with rotary ultrasonic horns to form a unitary web. The apparatus can operate at web speeds greater than 1000 feet minute.

REFERENCES:
patent: 3844869 (1974-10-01), Rust, Jr.
patent: 3879256 (1975-04-01), Rust, Jr.
patent: 4394208 (1983-07-01), Wang et al.
patent: 4414045 (1983-11-01), Wang et al.
patent: 4419160 (1983-12-01), Wang et al.
patent: 4426244 (1984-01-01), Wang
patent: 4427485 (1984-01-01), Kutnyak et al.
patent: 4504539 (1985-03-01), Petracek et al.
patent: 4713132 (1987-12-01), Abel et al.
patent: 4758293 (1988-07-01), Samida
patent: 5087230 (1992-02-01), Neuwirth
patent: 5096532 (1992-03-01), Neuwirth et al.
patent: 5110403 (1992-05-01), Ehlert
patent: 5552013 (1996-09-01), Ehlert et al.
patent: 5645681 (1997-07-01), Gopalakrishna et al.
patent: 5660679 (1997-08-01), Rajala et al.
patent: 5733411 (1998-03-01), Bett

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