Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2008-01-15
2008-01-15
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C174S255000, C174S260000
Reexamination Certificate
active
11306657
ABSTRACT:
A flexible circuit interposer includes a flexible circuit substrate which allows in-situ probing of an attached device during, for example, circuit debugging, assembly qualification, and the like. A first set of pads (and optionally a fourth set of pads) is configured in a predetermined pattern on the bottom surface of a flexible substrate. Similarly, a second set of pads is configured in substantially the same pattern on the top surface of the flexible substrate, wherein the pads in the second set of pads is electrically continuous with a pad in the first set of pads. A third set of pads is configured in substantially the same pattern on the top surface of the flexible substrate. One or more conductive traces are formed to connect one or more pads in the third set of pads with one or more pads in the first or the second set of pads.
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patent: 7071420 (2006-07-01), Chambers
Fletcher Yoder
Micro)n Technology, Inc.
Potter Roy
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