Methods and apparatus for a flexible circuit interposer

Details Methods and apparatus for a flexible circuit interposer Methods and apparatus for a flexible circuit interposer

2006-07-04

2006-07-04

Miska, Vit (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S262000

Reexamination Certificate

active

07071420

ABSTRACT:
A flexible circuit interposer includes a flexible circuit substrate which allows in-situ probing of an attached device during, for example, circuit debugging, assembly qualification, and the like. In accordance with one embodiment, a first set of pads (for example, bond pads configured to interface with solder balls) are configured in a predetermined pattern on the bottom surface of a flexible substrate. Similarly, a second set of pads are configured in substantially the same pattern on the top surface of the flexible substrate, wherein each of the pads in the second set of pads is electrically continuous with a corresponding pad in the first set of pads. A third set of pads are configured in the same pad pattern on the top surface of the flexible substrate. One or more conductive traces are formed to connect one or more pads in the first set of pads with spatially-corresponding pads in the third set of pads. A fourth set of pads corresponding to the third set of pads may also be provided on the bottom surface of the flexible substrate.

REFERENCES:
patent: 3923359 (1975-12-01), Newsam
patent: 6041495 (2000-03-01), Yoon et al.
patent: 6047469 (2000-04-01), Luna
patent: 6670700 (2003-12-01), Hashimoto
patent: 6765288 (2004-07-01), Damberg
patent: 6815621 (2004-11-01), Park et al.

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