Method with correction of hard mask pattern critical...

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

Reexamination Certificate

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Reexamination Certificate

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07901844

ABSTRACT:
A method for fabricating a photomask includes forming a light blocking layer, a hard mask layer, and a resist layer on a transparent substrate, forming a resist pattern to selectively expose the hard mask layer by removing the resist layer selectively, forming a hard mask pattern by etching the exposed hard mask layer using the resist pattern as an etch mask, exposing the hard mask pattern by removing the resist pattern; measuring a critical dimension of the exposed hard mask pattern, correcting the measured critical dimension of the hard mask pattern to correspond to a critical dimension of a target pattern, forming a light blocking pattern by etching the exposed light blocking layer using the corrected hard mask pattern as an etch mask, and removing the hard mask pattern.

REFERENCES:
patent: 4139443 (1979-02-01), Sakurai et al.
patent: 6989219 (2006-01-01), Magg
patent: 2005/0048377 (2005-03-01), Yang
patent: 2007/0026321 (2007-02-01), Kumar
patent: 2009/0053620 (2009-02-01), Ha
patent: 2009/0111035 (2009-04-01), Lee
patent: 10-2006-0053065 (2006-05-01), None
patent: 10 2007 0068910 (2007-07-01), None

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