Method using manifold system having flow control

Plastic and nonmetallic article shaping or treating: processes – With measuring – testing – or inspecting

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C264S328800, C264S040500, C425S145000, C425S572000, C425S573000

Reexamination Certificate

active

06436320

ABSTRACT:

FIELD OF THE INVENTION
This invention relates to injection of pressurized materials through a manifold, such as injection molding of plastic melt in a hot runner system. More specifically, this invention relates to an improved injection molding hot runner system in which the rate of melt flow is controlled through the gate during an injection molding cycle.
DESCRIPTION OF THE RELATED ART
U.S. Pat. No. 5,556,582 discloses a multi-gate single cavity system in which the rate of melt flow through the individual gates is controlled independently via a control system according to specific target process conditions. This system enables the weld line of the part (the section of the part in which the melt from one gate meets the melt from another gate) to be selectively located. It also enables the shape of the weld line to be altered to form a stronger bond.
The '582 patent discloses controlling the rate of melt flow with a tapered valve pin at the gate to the mold cavity. It also discloses placing a pressure transducer inside the mold cavity. Placing the pressure transducer inside the mold cavity can result in the pressure transducer sensing pressure spikes which can occur when the valve pin is closed. A pressure spike sensed by the transducer can cause an unintended response from the control system, and result in a less precise control of the melt flow than desired.
The control system disclosed in the '582 patent uses the variables of valve pin position and cavity pressure to determine what position the valve pin should be in. Thus, the algorithm performed by the control system in the '582 patent utilizes two variables to control the rate of melt flow into the cavity.
SUMMARY OF THE INVENTION
An injection molding apparatus is provided in which the rate of material flow during the injection cycle is controlled. According to one preferred embodiment, a method is provided for use in an injection molding apparatus including a hot runner assembly comprising a manifold and at least first and second injection nozzles, the hot runner assembly to direct material injected into said manifold through said at least first and second injection nozzles through a corresponding at least first and second gates to one or more mold cavities. The method includes the steps of injecting material into the manifold, controlling, in the hot runner away from the first gate, a first rate at which material is injected through the first gate, and controlling, in the hot runner away from the second gate, a second rate at which material is injected through the second gate, independently from the first rate.
According to another embodiment, a method is provided for use in an injection molding apparatus including a hot runner to direct material injected into the hot runner and through a gate and into one or more mold cavities. The method includes the steps of injecting material into the hot runner assembly, sensing, in the hot runner, a sensed condition related to a rate at which material is injected through the gate, and controlling the rate based on said sensed condition.


REFERENCES:
patent: 3535742 (1970-10-01), Marcus
patent: 3718166 (1973-02-01), Gordon
patent: 3780764 (1973-12-01), Geist
patent: 3820928 (1974-06-01), Lemelson
patent: 3861841 (1975-01-01), Hanning
patent: 3952927 (1976-04-01), Schaumburg et al.
patent: 3982440 (1976-09-01), Groleau et al.
patent: 4389002 (1983-06-01), Devellian et al.
patent: 4500279 (1985-02-01), Devellian et al.
patent: 4521179 (1985-06-01), Gellert
patent: 4588367 (1986-05-01), Schad
patent: 4592711 (1986-06-01), Capy
patent: 4863369 (1989-09-01), Schad et al.
patent: 4932854 (1990-06-01), Matsuda et al.
patent: 5078589 (1992-01-01), Osuna-Diaz
patent: 5141696 (1992-08-01), Osuna-Diaz
patent: 5149547 (1992-09-01), Gill
patent: 5288222 (1994-02-01), Weiser
patent: 5356576 (1994-10-01), Fischbach
patent: 5389315 (1995-02-01), Yabushita
patent: 5492467 (1996-02-01), Hume et al.
patent: 5545028 (1996-08-01), Hume et al.
patent: 5554395 (1996-09-01), Hume et al.
patent: 5556582 (1996-09-01), Kazmer
patent: 5674439 (1997-10-01), Hume et al.
patent: 5849236 (1998-12-01), Tatham
patent: 5871786 (1999-02-01), Hume et al.
patent: 5885628 (1999-03-01), Swenson et al.
patent: 5894025 (1999-04-01), Lee et al.
patent: 5916605 (1999-06-01), Swenson et al.
patent: 5948448 (1999-09-01), Schmidt
patent: 5948450 (1999-09-01), Swenson et al.
patent: 5980237 (1999-11-01), Swenson et al.
patent: 6000831 (1999-12-01), Triplett
patent: 6001296 (1999-12-01), Rodenburgh et al.
patent: 6027328 (2000-02-01), Herbst
patent: 6254377 (2001-07-01), Kazmer et al.
patent: 6261075 (2001-07-01), Lee et al.
patent: 6294122 (2001-09-01), Moss et al.
patent: 6309208 (2001-10-01), Kazmer et al.
patent: 6343921 (2002-02-01), Kazmer et al.
patent: 6343922 (2002-02-01), Kazmer et al.
patent: 2034163 (1971-02-01), None
patent: 24 01 168 (1975-07-01), None
patent: 299 09 535 (1999-08-01), None
patent: 0 911 137 (1999-04-01), None
patent: 58-142833 (1983-08-01), None
patent: 60-212321 (1985-10-01), None
patent: 61-633428 (1986-04-01), None
patent: WO 97/43105 (1997-11-01), None
patent: WO 98/56564 (1998-12-01), None
patent: WO99/54109 (1999-10-01), None
patent: WO99/59795 (1999-11-01), None
patent: WO 01/08462 (2001-02-01), None
Patent Abstracts of Japan, Publication No. 63166511, Date of Publication: Sep. 7, 1988, Applicant: Nissei Plastics Ind. Co., Inventor: Takayama Kazutoshi, Title: Injection Molding.
Patent Abstracts of Japan, Publication No.: 61-63428, Date of Publication: Jan. 4, 1986 Applicant: Nippon Denso Co. Ltd, Inventor: Koyama, Title: Mold Assembly.
International Search Report from International Application No. PCT/US 98/10798, filed May 27, 1998.
Translation for Japanese Unexamined Patent Application No. 61-63428, Date of Publication: Jan. 4, 1986, Applicant: NEC, Inventor: Hiroshi Koyama, Title: Mold Apparatus.
“Multi-Cavity Pressure Control in the Filling and Packing Stages of the Injection Molding Process” D. Kazmer and P. Barkan, Polymer Engineering and Science, Nov./97, vol. 37, No. 11, pp. 1865-1879.
“The Process Capability of Multi-Cavity Pressure Control for the Injection Molding Process”, D. Kazmer and P. Barkan, Polymer Engineering and Science, Nov. 1997, vol. 37, No. 11, pp. 1880-1895.
“Dynamic Feed Control: A New Method for Injection Molding of High Quality Plastic Parts”, D. Kazmer, Jun. 1995, a dissertation submitted to the Design Division of Mechanical Engineering and The Committee on Graduate Studies in Partial Fulfillment of the Requirements for the Degree of Doctor Of Philosophy in Mechanical Engineering.
Patent Abstracts of Japan, Publication No. 2000141439, Publication Date May 23, 2000, Applicant: Kobe Steel Ltd., Title: Injection Compression Molding Device.
International Search Report for International Application No. PCT/US 00/25861.
Abstract -Japanese Publication No. 58-142833, Aug. 25, 1983, Kobe Steel, Ltd., “Control Method for Injection Molding Machine.”

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method using manifold system having flow control does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method using manifold system having flow control, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method using manifold system having flow control will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2898369

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.