Method using a thick joint for joining parts in SiC-based materi

Details Method using a thick joint for joining parts in SiC-based materi Method using a thick joint for joining parts in SiC-based materi

1997-06-03

1999-11-02

Ryan, Patrick

Metal fusion bonding

Process

Bonding nonmetals with metallic filler

2281245, 2282485, 420578, B23K 3102, C22C 2900

Patent

active

059754079

ABSTRACT:
A method of joining at least two parts in silicon carbide based material by refractory brazing in which these parts are brought into contact with an intermetallic braze alloy and said parts and braze alloy are heated to a braze temperature equivalent to the melting temperature of the braze alloy in order to form a refractory joint characterized in that the intermetallic braze alloy comprises 1 to 18% by weight of cobalt and from 82 to 99% by weight of silicon, and in that the joint obtained is a thick joint, that is to say with a thickness of generally from 0.1 to 0.5 mm, and a thick refractory joint obtained by this method, wherein bonds of silicon carbide parts with thick joints prepared using the method of the invention allow the production with great precision of structures, apparatus and components with complex shapes having high temperatures of use reaching as high as 1000.degree. C. and even higher.

REFERENCES:
patent: 3813759 (1974-06-01), Heap et al.
patent: 4499360 (1985-02-01), Rottenbacher
patent: 5447683 (1995-09-01), Montgomery et al.
W. Tillmann, et al., DVS Verlag GmbH, pp. 110-115 1995, "Possibilities of Production of High Temperature Resistant Bonds to Non-Oxide Engineering Ceramics Using Various Brazing Concepts" *(With Partial English Translation).
E. Lugscheider, et al., BABS 6.sup.th International Conference, pp. 1-16, Sep. 3-5, 1991, "Development of New Active Filler Metals for Joining Silicon Carbide and -Nitride".
M. Naka, et al., ISIJ International, vol. 30, No. 12, pp. 1108-1113, 1990, TI-Precoating Effect on Wetting and Joining of Cu to SiC.
J.K. Boadi, et al., Journal of Materials Science, vol. 22, pp. 2431-2434, 1987, "Brazing of Pressureless-Sintered SiC Using Ag-Cu-Ti Alloy".
S. Kalogeropoulou, et al., Acta metall., mater., vol. 43, No. 3, pp. 907-912, 1995, "Relationship Between Wettability and Reactivity in Fe/SiC System".

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