Method to solve sog non-uniformity in the VLSI process

Details Method to solve sog non-uniformity in the VLSI process Method to solve sog non-uniformity in the VLSI process

1993-07-22

1994-12-06

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437195, H01L 21465

Patent

active

053710460

ABSTRACT:
A new method of planarizing an integrated circuit is described. A first coating of a silicate spin-on-glass material is applied to the surface of a patterned conductor layer to be planarized. The spin-on-glass material is applied under low relative humidity, filling the valleys of the irregular structure of the conductor layer. The first spin-on-glass layer is covered with a second coating of the spin-on-glass material also applied under low relative humidity. Then, both first and second spin-on-glass layers are cured. This method provides a uniform spin-on-glass dielectric layer upon which a second conductor layer may now be successfully applied.

REFERENCES:
patent: 5106787 (1992-04-01), Yen
patent: 5250472 (1993-10-01), Chen et al.
patent: 5270267 (1993-12-01), Ouellet
CRC Handbook of Chemistry and Physics, 64th Ed (1983-84), Robert Weast (Ed.), CRC Press, Boca Raton, Fla., p. F-102.

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