Method to reduce particulates in device manufacture

Details Method to reduce particulates in device manufacture Method to reduce particulates in device manufacture

1996-10-04

1998-06-16

Warden, Jill

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 1, 134 6, 134 32, B08B 702

Patent

active

057663696

ABSTRACT:
An improved process for manufacturing semiconductor devices (10). The device, which could be a semiconductor wafer, an individual chip, or a device that has integrated within it semiconductor devices, such as a compact disk drive, is placed or held upside down with its working surface (12) open. The device (10) is struck, causing particulates (18) attached to the working surface (12) to fall free of the device. Alternately, the device could be sharply decelerated to apply the shock. Additionally, the device could be held substantially vertical and rotated to use centrifugal force to separate the particulates away from the device.

REFERENCES:
patent: 3765941 (1973-10-01), Gordon
patent: 4111546 (1978-09-01), Maret
patent: 5427644 (1995-06-01), Nagatsuka et al.
Handbook of Semiconductor Wafer Cleaning Technology, Werner Kern editor, Noyes publications, 1993.

Affiliated with

Also associated with

Rating

Method to reduce particulates in device manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method to reduce particulates in device manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method to reduce particulates in device manufacture will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1720495