Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2005-09-20
2005-09-20
Zarneke, David (Department: 2829)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S690000, C257S773000, C257S786000
Reexamination Certificate
active
06946746
ABSTRACT:
A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.
REFERENCES:
patent: 6160705 (2000-12-01), Stearns et al.
Beaulieu Frederic
Kuzawinski Mark J.
Mainville Stephane
Ouimet Sylvain
Quintal Jean-Guy
Geyer Scott B.
International Business Machines - Corporation
Scully Scott Murphy & Presser
Steinberg William H.
Zarneke David
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