Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Groove formation
Reexamination Certificate
2011-08-16
2011-08-16
Louie, Wai-Sing (Department: 2814)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Groove formation
C438S048000, C438S282000, C438S424000, C438S426000, C438S910000, C257SE21545
Reexamination Certificate
active
07998772
ABSTRACT:
A method for forming a protection diode utilizes processing operations and materials used in the formation of the CMOS integrated circuit device and provides a protection diode used in CMOS integrated circuit devices to direct charged particles to benign locations and prevent damage to the devices. The protection diode includes a well region of a first conductivity type formed in a surface of a semiconductor substrate, a heavily doped P-type impurity region disposed within the well region, a heavily doped N-type impurity region disposed within the well region and an STI structure interposed therebetween. A top surface of the STI structure extends above the surface. A silicide resistant block-out layer is formed over the STI structure and extends laterally beyond the STI structure, covering any counterdoped sections that may undesirably be formed in the substrate adjacent the STI structure during implantation operations.
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Chang Jieh-Ting
Chang Tzong-Sheng
Shen Yung-Fu
Tien Bor-Zen
Duane Morris LLP
Louie Wai-Sing
Taiwan Semiconductor Manufacturing Co. Ltd
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