Method to reduce ferric ions in ferrous based plating baths

Details Method to reduce ferric ions in ferrous based plating baths Method to reduce ferric ions in ferrous based plating baths

2005-05-05

2008-10-07

Wong, Edna (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating process fluid by means other than agitation or...

C205S099000, C205S101000, C205S255000, C205S270000

Reexamination Certificate

active

07431815

ABSTRACT:
A process for cathodically reducing unwanted Fe+3ions to needed Fe+2ions in an acidic ferrous based plating bath without reducing agents is disclosed. An auxiliary potential of 0.1 to 0.3 volts vs. SCE is applied between the working electrode and a reference electrode and can reduce the molar ratio [Fe+3]/[Fe+2] to 1 ppm without depositing Fe or other metals on the working electrode or causing hydrogen evolution. The process is applicable to electroplating soft magnetic films such as NiFe, FeCo, and CoNiFe and can be performed during plating or during cell idling. The process is cost effective by reducing the amount of hazardous waste and tool down time due to routine solution swap. Other benefits are improved uniformity in composition and thickness of plated films because issues associated with decomposed reducing agents are avoided.

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Co-pending, U.S. Patent HT-03-042, U.S. Appl. No. 10/860,716, filed Jun. 3, 2004, “Electrodeposition of FeCoNiV Films with High Resistivity and High Satuvation Magnetization,” assigned to the same assignee.
“A High Moment CoFe Soft Magnetic Thin Film Prepared by Electro deposition,” Osaka et al., Elec. & Solid St. Lts., 6(4), pp. C53-C55, 2003.

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